Thermal Encapsulation
Thermal Encapsulation Solutions for Reliability, Protection & Heat Management
GB International provides thermal encapsulation solutions designed to protect and enhance the performance of custom magnetic components and electronic assemblies. Our encapsulation processes are engineered to improve heat dissipation, mechanical stability, and environmental protection in demanding applications.
Thermal encapsulation is often integrated into transformer and inductor programs, but it is also available as a standalone service for customers requiring enhanced durability, thermal control, or environmental sealing.
Thermal encapsulation is the process of enclosing electronic components or magnetic assemblies in a protective material, such as epoxy or resin, to manage heat transfer and shield components from environmental stressors.
Encapsulation may be used to:
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Improve thermal conductivity and heat dissipation
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Protect against moisture, dust, and contaminants
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Reduce vibration and mechanical stress
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Increase long-term reliability and product lifespan
GB International engineers encapsulation solutions based on the electrical, thermal, and mechanical demands of the end application rather than applying a one-size-fits-all approach.
When Is Thermal Encapsulation Used?
Thermal encapsulation is commonly used when components must operate reliably in harsh or demanding environments, including:
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Elevated or fluctuating temperatures
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High vibration or mechanical shock
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Exposure to moisture, chemicals, or airborne contaminants
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Electrically sensitive or safety-critical systems
Encapsulation is not always required; GBI works with customers to determine when thermal encapsulation adds measurable value versus alternative design approaches.
GB International supports a range of encapsulation and potting solutions, tailored to the application:
Thermally Conductive Encapsulation
Materials selected to enhance heat transfer away from heat-generating components while maintaining electrical insulation.
Protective Potting & Sealing
Encapsulation designed to shield components from environmental exposure, corrosion, and contamination.
Vibration & Mechanical Stabilization
Encapsulation used to reduce movement, absorb shock, and protect internal connections in high-vibration environments.
Application-Specific Material Selection
Material properties such as hardness, thermal conductivity, cure profile, and environmental resistance are selected based on system requirements.
Applications for Thermal Encapsulation
Thermal encapsulation solutions from GB International are used across a wide range of industries and systems, including:
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Automotive and transportation electronics
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Industrial automation and controls
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Power conversion and energy systems
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Grid infrastructure and power distribution
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Medical and diagnostic equipment
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Aerospace, defense, and ruggedized electronics
Encapsulation is frequently applied to custom inductors and transformers to improve thermal and mechanical performance.
Engineering & Manufacturing Approach
Thermal encapsulation at GBI is supported by integrated engineering and manufacturing teams in Endicott, New York and Huizhou, China. This dual-site model enables:
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Early-stage design collaboration
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Prototyping and validation
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Scalable production support
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Long-term program consistency
Encapsulation is engineered as part of the overall component design, ensuring compatibility with electrical performance, manufacturability, and lifecycle requirements.
Frequently asked questions
Request Thermal Encapsulation Information
To discuss a thermal encapsulation requirement or determine whether encapsulation is appropriate for your application, contact our team. Our engineers can review your operating environment, thermal needs, and performance goals to recommend the most effective solution.